SiC(silicon
carbide) 6H |
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The influence of polarity on the SiC crystal growth has been
demonstrated using a dual-seed technique to grow on both the C- and Si-face
seed simultaneously. For the investigated range of growth conditions, 4H-SiC
crystals were grown on the C-face of 6H-SiC seed crystals with on-axis
orientation, when the growth rate exceeded 1.2 g/h. We were never able to
grow 4H-SiC on the Siface of 6H- or 4H-SiC seed crystals under these growth
conditions. The incorporation of nitrogen is shown to be 2–3 times higher in
crystals grown on the C-face than on the Si-face, and is independent of both
polytype and 8° off-axis orientation. The addition of more than 15% silicon
powder to the SiC sublimation source resulted in polycrystalline growth.
6H SIC wafer is firstly commercialized in 1991. For 6H polytype, normally its orientation should be on axis, that is C(0001), however some customers require specific application, also use off axis such as 4deg.off.
Because of wide band gap, the carrier concentration of intrinsic SiC is low, that is why SIC electronic device may work at high temperature but small current leakage. However 6H-SIC is much lower carrier concentration:
6H-SIC: carrier concentration: ~1x10^-16/cm3
4H-SIC: carrier concentration: ~1x10^-9/cm3
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Xiamen Powerway Advanced Material Co.,Ltd can offer SiC 6H as follows: |
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1)5*5,10*10,15*15,2” SiC 6H
2" dia 6H-N
Type/ Dopant : N / Nitrogen
Orientation : <0001>±0.5°;3.5°towards toward < 112(bar)0 > + 0.5°
Thickness : 330 ± 25 um;440+/-25um
MPD<10cm-2;MPD<30 cm-2;MPD<100 cm-2 RT:0.02-0.2Ω•cm
Bow/Warp/TTV<35um
Double face polished/Si face epi-ready with CMP,Surface Roughness : <0.5 nm
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2)10mm*10mm,2" SiC 6H
2" dia 6H-SI
Type/ Dopant : SI / V
Orientation : <0001>±0.5°
Thickness : 330 ± 25 um;430±25um
MPD<10cm-2;MPD<30 cm-2;MPD<100 cm-2 RT:≥1E5Ω•cm
Bow/Warp/TTV:<35um
Double face polished/Si face epi-ready with CMP,Surface Roughness : <0.5 nm | | |
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3) 2" SiC 6H
2" dia 6H-N
Type/ Dopant : SI / V
Orientation : <0001>of 4deg.off
Thickness : 330 ± 25 um;
MPD<10cm-2;MPD<30 cm-2;MPD<100 cm-2 RT:0.02-0.2Ω•cm
Bow/Warp/TTV:<35um
Double face polished/Si face epi-ready with CMP,Surface Roughness : <0.5 nm
Bow/Warp/TTV:<35um | | |
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4)2”, 3",4"SiC 4H
2" dia 4H-N
Type/ Dopant : N / Nitrogen
Orientation : : <0001>±0.5°;4 +/-0.5°
Thickness : 350 ± 25 um
MPD<10cm-2;MPD<30 cm-2;MPD<100 cm-2
RT:0.01-0.1 Ω•cm
Bow/Warp/TTV<45um
Double face polished/Si face epi-ready with CMP,Surface Roughness : <0.5 nm
5)2”, 3",4"SiC 4H
2" dia 4H-SI
Type/ Dopant : SI / V
Orientation : : <0001>±0.5°;4 +/-0.5°
Thickness : 350 ± 25 um
MPD<10cm-2;MPD<30 cm-2;MPD<100 cm-2 RT:≥1E5Ω•cm
Bow/Warp/TTV<45um
Double face polished/Si face epi-ready with CMP,Surface Roughness : <0.5 nm | | |
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5)Specification for Epitaxial Products on SiC substrate
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Parameter
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Nominal value
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On-wafer variation
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Thickness of GaN buffer(um)
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1.8 um
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+/- 0.25 um
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AlGaN compostion(%Al)
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30%
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+/-1.25 %
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AlGaN thickness (nm)
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7 nm
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+/-1 nm
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AlN thickness
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1 nm
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+/-0.5 nm
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Sheet resistivity (ohms/sq)
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<360 for SiC substrate (for 30% AlGaN)
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Std. Dev. < 7.5%
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Mobility (cm2/V-sec)
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>1700 for SiC substrate
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Sheet concentration (/cm³)
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>1e13
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XRD(102)rocking curve FWHM (")
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<300 for SiC substrate
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Typically 220
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XRD(002)rocking curve FWHM (")
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<260 for SiC substrate
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Typically 180
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Bow
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<30um
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Buffer layer resistivity (ohms/sq)
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>1e5
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Substrate resistivity (ohms/sq)
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>10000
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Particulates or other defects(/cm²)
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<2
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GaN Cap Layer
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2nm
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Basic
parameters of 6H SiC
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Crystal structure
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6H-SiC
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Wurtzite ( Hexagonal)C46v-P63mc
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Remarks
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Crystal structure
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6H-SiC
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Wurtzite ( Hexagonal)
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Group of symmetry
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6H-SiC
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C46v-P63mc
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Bulk modulus
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6H-SiC
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2.2 x 1012 dyn cm-2
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theoretical estimation
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0.97 x 1012 dyn cm-2 (experimental data)
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Debye temperature
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6H-SiC
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1200 K
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Melting point
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6H-SiC
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3103 ± 40 K
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at 35 atm. see also Phase diagram
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Density
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6H-SiC
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3.21 g cm-3
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300 K
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Hardness
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6H-SiC
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9.2-9.3
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on the Mohs scale
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Surface microhardness
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6H-SiC
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2900-3100 kg mm-2
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Dielectric constant
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6H-SiC
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ε0,ort ~= 9.66
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300 K
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(static, ordinary direction)
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Dielectric constant
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6H-SiC
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ε0, || ~= 10.03
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300 K
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(static, extraordinary direction)
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Ratio between the static dielectric constant
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6H-SiC
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ε0,ort / ε0, || ~= 0.9631
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300 K
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(ordinary and extraordinary direction)
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Dielectric constant
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6H-SiC
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εort ~= 6.52
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300 K
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(high frequency, ordinary direction)
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Dielectric constant
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6H-SiC
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ε || ~= 6.70
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300 K
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(high frequency, extraordinary direction)
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Infrared refractive index
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6H-SiC
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~=2.55 (⊥c axis)
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300 K
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~=2.59 ( ||c axis)
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Refractive index n(λ)
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6H-SiC
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n0(λ)~= 2.55531 + 3.34 x 104·λ-2
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300K, 467nm < λ< 691nm
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ne(λ)~= 2.5852 + 3.68 x 104·λ-2
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also see Refractive index n vs. wavelength and photon energy
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Radiative recombination coefficient
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6H-SiC
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1.5 x 10-12 cm3/s
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300 K, estimation
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Optical photon energy
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6H-SiC
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104.2 meV
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300 K
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Effective electron mass
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6H-SiC
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0.20mo
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300 K
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(longitudinal)ml
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Effective electron mass
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6H-SiC
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0.42mo
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(transverse)mt
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Effective mass of density of states mcd
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6H-SiC
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2.34mo
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Effective mass of the density of states
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6H-SiC
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0.71mo
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in one valley of conduction band mc
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Effective mass of conductivity mcc
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6H-SiC
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0.57mo
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Remarks
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Effective hall mass of density of state mv�
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6H-SiC
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~1.0 mo
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300 K
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Lattice constant,
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6H-SiC
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a = 3.0730 A
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297 K, Debye-Scherrer;
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b = 10.053
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see also Temperature dependence
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Categorizing
the polytypes |
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A shorthand has been developed to catalogue the vast number of
possible polytype crystal structures: Let us define three SiC bilayer
structures (that is 3 atoms with two bonds in between in the pictures below)
and label them as A, B and C. Elements A and B do not change the orientation
of the bilayer (except for possible rotation by 120°, which does not change
the lattice and is ignored hereafter); the only difference between A and B is
shift of the lattice. Element C, however, twists the lattice by 60°.
Related Products: | | | |
6h sic 0001 | | | |
6h-sic structure | | | |
6h-sic substrate | | | |
6h-sic lattice constant | | | |
6h-sic polytype | | | |
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SiC wafer reclaim, can you gurantee surface roughness<=0.3nm?
ReplyDeleteSure, no problem
Delete