Jan 20, 2019

Defect introduction during E-beam metal deposition on bulk n-type 6H–SiC

Deep level transient spectroscopy is employed in order to assess whether E-beam metal deposition on bulk n-type 6H–SiC effects any changes to the underlying material. Near-surface E-beam-related damage is shown to be device specific. The EB1-related defect at Ec − (0.346 ± 0.007) eV with σna = (5.4+1.5−1.2) × 10−16 cm2 and the EB2-related defect at Ec − (0.47 ± 0.01) eV with σna = (2.2+0.5−1.7) × 10−15 cm2 are detected in several devices, independently of the metal used for deposition. It is shown that the broad EB3 peak, detected in a set of E-beam fabricated devices, corresponds to the p5-related band of interface states also detected in thermally metallized devices. It is shown that neither the EB3 nor the p5 peak can be detected in environmentally aged E-beam fabricated devices. This is attributed to interface state passivation via in-diffusion of atmospheric oxygen.


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